|
Linet Oy introduces its core product, the single chip node. The process for production quantity manufacturing has started. The first shipments to customers will be dispatched in August 1999. The node will be available as two versions: an IC or a hybrid. The IC is a SMT packaged node, requiring a few external low-cost components to operate. It is intended to price and size sensitive OEM applications. The hybrid is a fully functional assembly, described as 'a plug-and-play network card for embedded systems', offering easiness and fast time to market in small production volume applications. It will replace the previous, 'LIN01-1' node. 'The Linet single-chip node combines analogue, digital and high voltage IC technology in a way nobody has, according to our knowledge, taken in use before', says Mr. Seppo Laine, manager of R&D. 'Prototypes for the single-chip node have been under evaluation for nearly a year. Their performance has exceeded our expectations being far above the 'LIN01-1' hybrid, which was also considered very good. In spite of being a high-tech product, the new single chip node offers unforeseen easiness of use in a low-cost package suitable for high volume production.' Node versions:
The data sheet for the single-chip
node and the renewed hybrid is available as a pdf-document at http://www.linet.fi/assets/download/lin02.pdf.
About the company:
Linet Oy is a privately held company committed in developing and marketing
the Linet network. Products available from Linet are the network chipset
and design services. Linet, 'the light network', is an innovative local
operational network offering easiest design, set-up and administration
in such simple network applications as home automation, data acquisition
systems or small-scale industry automation. The Linet network is patented
in the USA and Finland, other patents are under pending.
Linet Oy, 24th May 1999 |